trimable chip resistors design, specifications are subject to change without notice. ask factory for technical specifications before purchase and/or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. trimable chip resistors erj tl : 1206 erj gl: 0805, 1206 erj l : 1210 type: erj 8tl, 6gel, 8gel, 14l e 1 r 2 j 3 8 4 t 5 l 6 n 7 1 8 0 9 1 10 v 11
thick film
chip resistors product code size, power rating type: inches 8tl : 1206 6gel : 0805 8gel : 1206 14l : 1210 0.063 w 0.1 w 0.125 w 0.25 w power r. resistance tolerance code k m n 10% * 20% * 30% ** tolerance the first two digits are significant figures of resistance and the third one denotes number of zeros following. resistance value packaging methods code v u packaging punched (paper) taping embossed taping (14l only) * 6gel, 8gel, 14l only ** 8tl only n features l small size and lightweight for pcb size reduction and lightweight products l high reliability metal glaze thick film resistive element and three layers of electrodes result in high reliability l high magnification resistance adjustment high magnification trimming is possible (more than 10 magunifications the initial resistance value as for erj8tl) n explanation of part numbers
trimable chip resistors design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. n construction n dimensions in mm (not to scale) type erj8tl type erj6gel, 8gel,14l n general specifications item specifications resistance range resistance tolerance power rating at 70 ?c 10 w to 1 m w , e12 series erj8tl: 30 % erj6gel, 8gel, 14l: 10 %, 20 % erj8tl:0.063 w erj6gel:0.1 w erj8gel:0.125 w erj14l:0.25 w n resistance adjustment curve type erj8tl l using method type erj6gel, erj8gel, erj14l l using method resistor clear grass 0.60 1.8 0.6 0.3 0.6 8- f 0.3 2.4 3.20 1.60 0.25 0.25 l w t erj6gel 2.00 1.25 0.60 erj8gel 3.20 1.60 0.60 erj14l 3.20 2.50 0.60 t resistor clear grass l w solder pad design 0 0 50 100 1 2 3 4 5 6 7 8 9 10 11 12 13 cutting rate (%) adjustment magnifications mounting and trimming direction trimming 1.0 1.5 2.0 2.5 3.0 adjustment magnifications cutting rate (%) 0 50 100 w2 w1 how to trimming: single cut cutting rate: w2/w1 100 protective coating high purity alumina substrate termination (inner) termination (between) resistive element termination (outer)
trimable chip resistors design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. 8tl 6gel 4.00 0.10 2.00 0.05 4.00 0.10 1.50 +0.10 0.84 0.05 8gel 8tl 2.00 0.15 3.60 0.20 6gel 1.60 0.15 2.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 8gel 1.90 0.15 3.50 0.20 erj8tl 0.6 5000 pcs./reel (1206) erj6gel 0.6 5000 pcs./reel (0805) erj8gel 0.6 5000 pcs./reel (1206) erj14l 0.6 5000 pcs./reel (1210) 14l 2.00 0.05 4.00 0.10 1.50 +0.10 1.00 0.10 1 min. 0 14l 2.80 0.20 3.50 0.20 8.00 0.30 3.50 0.05 1.75 0.10 4.00 0.10 n packaging methods l standard quantity punched (paper) taping (4 mm pitch) embossed taping (4 mm pitch) type (inches) thickness (mm) l taping reel l embossed taping l punched (paper) taping f b w t f a f c fe w f d 1 p 1 p 2 p 0 t a b tape running direction chip component sprocket hole compartment f d 0 fe w p 1 p 2 p 0 t a b tape running direction chip component sprocket hole compartment f d 0 type abwfe dimensions (mm) type p 1 p 2 p 0 f d 0 t dimensions (mm) type a b w f e p 1 dimensions (mm) dimensions (mm) type p 2 p 0 f d 0 t f d 1 0 0 f a f b f cw t 180.0 e3.0 60 min. 13.0 1.0 9.0 1.0 11.4 2.0 dimensions (mm)
trimable chip resistors design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. cautions for safety 1. if transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with the resistors actually mounted on your own board. when the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. never exceed the rated power. 2. chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. 3. when soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. when using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less up to 350 ?c). 4. avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistor?s performance. preheating peak heating temperature time erj6gel 1 to 1.4 3.2 to 3.8 0.9 to 1.4 (0805) erj8gel 2 to 2.4 4.4 to 5 1.2 to 1.8 (1206) erj14l 2 to 2.4 4.4 to 5 1.8 to 2.8 (1210) in the case of flow soldering, the land width must be smaller than the chip resistor width to control the solder amount properly. generally, the land width should be 0.7 to 0.8 times (w) of the width of chip resistor. in the case of reflow solderi ng, solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (w). chip resistor c a b type (inches) dimensions (mm) abc n recommended land pattern chip resistor 2.40 0.4 to 0.45 0.4 to 0.45 2.0 to 2.4 0.7 to 0.9 n recommended soldering conditions recommendations and precautions are described below. l recommended soldering conditions for reflow reflow soldering shall be two times maximum. please contact us for additional information when you use in conditions other than those specified. please measure a temperature of terminations and study solderability every kind of solder and board, before actual use. temperature time preheating 140 ?c to 160 ?c 60 s to 120 s main heating above 200 ?c 30 s to 40 s peak 235 5 ?c max. 10 s temperature time preheating 150 ?c to 180 ?c 60 s to 120 s main heating above 230 ?c 30 s to 40 s peak max. 260 ?c max. 10 s for solder (example : sn/pb) for lead-free solder (example : sn/ag/cu) l recommended soldering conditions for flow for solder for lead-free solder temperature time temperature time preheating 140 ?c to 160 ?c 60 s to 120 s 150 ?c to 180 ?c 60 s to 120 s soldering 2455 ?c 20 s to 30 s max. 260 ?c max. 10 s
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